Seoul: Samsung Electronics, the world’s top memory chipmaker, said on 27 March that it has developed the industry’s first fusion semiconductor. This combines two different types of flash memory.
The Flex-OneNAND can help make handsets for mobile phones and multimedia gadgets much more compact at cheaper prices, Samsung officials said.
The product merges the two different NAND flash memory chips - the SLC type which excels in processing data quickly and the MLC type suitable for storing large amounts of data into a single set.
The ratio of SLC to MLC functions within the same device can be freely adjusted in accordance with different product needs.
The fusion memory chip was unveiled at the Samsung Mobile Solution Forum in Taiwan on 27 March.